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Back‑End Packaging & Test
OSAT, advanced packaging, and final test/handler investments.
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Myanmar Packaging Forum 2026: MOIMSMED UM delivered remarks via video conferencing
15+ hour, 28+ min ago (172+ words) Myanmar International TV Myanmar Packaging Forum 2026: MOIMSMED UM delivered remarks via video conferencing Aiming to promote safe and environmentally friendly products and packaging systems and to facilitate access to international markets, Myanmar Packaging Forum 2026 was held at Mingalar Hall of…...
Inline Surface Inspection in Progressive Dies at 400 SPM
16+ hour, 56+ min ago (230+ words) Detecting surface deviations directly inside a progressive die could help manufacturers reduce scrap and identify tool wear earlier. Fraunhofer IGD’s camera-based Inform-QC system inspects formed components at up to 400 strokes per minute without slowing production. Inform-QC can, for example, be…...
Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
21+ hour, 1+ min ago (123+ words) digitimes Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst Keep me signed in - Track financials & stock data of Taiwan tech. - Google TPU pays back investment in 1 year, creating upside for MediaTek,…...
ST Engineering Opens S$170 Million Airframe MRO Facility at Changi Creek
1+ day, 17+ hour ago (135+ words) ST Engineering's new S$170 million airframe MRO facility at Changi Creek adds four widebody hangar bays, creates over 500 jobs, and uses AI, robotics and automation to transform aerospace work in Singapore. The minister said that as capabilities across the aerospace…...
BOAL Extrusion expands profile range with stretch installation upgrade
2+ day, 8+ hour ago (307+ words) BOAL Extrusion NL, which develops, extrudes and processes custom aluminum profiles, has upgraded the stretching installation at its production site in De Lier, the Netherlands. The upgrade increases the profile range of the production line by 33%. It also makes the…...
GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components
2+ day, 12+ hour ago (224+ words) GF’s Malta, NY, fab will become first US source for supply of silicon interposers GlobalFoundries signs $2bn, five-year deal with TSMC for production of advanced packaging components GF’s Malta, NY, fab will become first US source for supply of silicon interposers…...
GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging
2+ day, 15+ hour ago (181+ words) The agreement has an initial five-year term, with volume production expected to begin ramping in the first half of 2028. Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies GF…...
Applied Materials, Inc. And BE Semiconductor Industries N.V. Expand Strategic Partnership To Advance Next-Generation Packaging For AI Scaling
2+ day, 17+ hour ago (284+ words) Applied Materials, Inc. and BE Semiconductor Industries N.V. announced an expansion of their longstanding strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner. The... and BE Semiconductor Industries N.V announced an expansion of their longstanding strategic partnership, with…...
Metrology Parts Releases "The Invisible Baseline: Why Exactness is Non-Negotiable on the Factory Floor"
3+ day, 13+ hour ago (305+ words) /PRNewswire/ -- Metrology Parts has announced the release of its latest resource, "The Invisible Baseline: Why Exactness is Non-Negotiable on the Factory Floor.... BAXTER, Minn., Oct. 7, 2026 /PRNewswire/ -- Metrology Parts has announced the release of its latest resource, "The Invisible Baseline: Why…...
Editorial Focus eBook - Semiconductor Inspection and Failure Analysis (2nd Edition)
5+ day, 10+ hour ago (186+ words) As semiconductor devices shrink and architectures grow more complex, defects are harder to spot and far more expensive to miss. This eBook looks at how inspection and failure analysis help manufacturers uncover subtle weaknesses, protect yield, and strengthen device reliability…...